To further expand trading opportunities and enhance your Futures trading experience, MEXC will launch KINSUS, YAGEO, NANYAPLST, NANYAPCB and ZHENDING Stock Futures on the Futures market. These new listings offer a flexible and efficient way to gain exposure to some of the most prominent equities. Futures trading will be available immediately upon listing, with Futures Grid Bot strategies available within 5 minutes of listing.
Futures Trading Details
Feature | Details | Details | Details | Details | Details |
Trading Pair | KINSUSUSDT | YAGEOUSDT | NANYAPLSTUSDT | NANYAPCBUSDT | ZHENDINGUSDT |
Listing Time | TBD | TBD | TBD | TBD | TBD |
Max Leverage | 20x | 20x | 20x | 20x | 20x |
Margin Mode | Cross & Isolated | Cross & Isolated | Cross & Isolated | Cross & Isolated | Cross & Isolated |
Trading Hours | 24/7 | 24/7 | 24/7 | 24/7 | 24/7 |
Introduction
KINSUS: It is an IC substrate (chip substrate) supplier headquartered in Taiwan, China, that manufactures and sells printed circuit boards, BGA substrates, flexible printed circuit boards, flexible substrates for chip packaging, and ABF substrates. It is the world's largest BT substrate supplier and the fifth largest ABF substrate manufacturer.
YAGEO: It is a leading global passive component manufacturer headquartered in Taiwan, China, mainly producing basic electronic components such as resistors, capacitors, and inductors.
NANYAPLST:Founded in 1995 and headquartered in Taiwan, this company manufactures memory chips and storage devices, and is well-known in the DRAM solutions field.
NANYAPCB: Headquartered in Taiwan, and a subsidiary of the Formosa Plastics Group, it is one of the world's top ten professional circuit board manufacturers.
ZHENDING: It is the world's largest PCB (Printed Circuit Board) manufacturer, headquartered in Taoyuan, Taiwan. Founded in 2006, it provides a full range of PCB products, including flexible printed circuit boards (FPC), substrate-like boards (SLP), high-density interconnect boards (HDI), and IC substrates, which are widely used in 5G communications, AI, consumer electronics, automotive electronics, and servers.
